The Japanese government told Reuters that Japan and the US will issue a joint statement on technology collaboration, reaffirming their commitment to advanced chip research and development and other technological endeavors.
Yomiuri reported that Japanese Minister of Economy, Trade, and Industry Yasutoshi Nishimura and U.S. Secretary of Commerce Gina Raimondo will meet in Detroit during the 2023 APEC Ministers Responsible for Trade Meeting. The publication stated that they will discuss quantum technologies, artificial intelligence, and semiconductors.
Japanese officials, who requested anonymity because they lacked media authorization, told Reuters about the two nations’ research and development goals. This collaboration advances their technological cooperation plans.
Washington and Tokyo are working together to strengthen their chip manufacturing capabilities amid rising tensions and a desire to reduce their dependency on Chinese supply chains. Advanced components drive economic development.
IBM and Japanese chipmaker Rapidus create cutting-edge logic semiconductors.
Japan also subsidizes Micron Technology Inc. (MU.O)’s manufacturing growth. Japan and the Netherlands have also agreed to follow US export regulations, restricting China’s purchase of chipmaking gear.
After the G7 leaders’ agreement in Hiroshima, Japan, Minister Nishimura and Secretary Raimondo’s meeting is significant. They signed this agreement to reduce China’s economic pressure.
In Washington, Secretary Raimondo and Wang Wentao discussed trade, investment, and export policy.