Operators are focusing on 5G radio size and weight to increase network density by placing more radios on towers and minimizing the aesthetic effect of radios on poles or buildings in urban areas.
NXP Semiconductors unveiled a series of top-side cooled RF amplifier modules based on a packaging breakthrough to allow smaller and lighter radios for 5G infrastructure to solve these challenges.
Smaller base stations are cheaper, easier to install, and fit in better. NXP’s GaN multi-chip module series and the industry’s first top-side cooling packaging technique for RF power lower the thickness, weight, and carbon footprint of 5G base stations by more than 20%.
5G radios are more smaller and lighter thanks to innovative packaging.
“Top-side cooling represents a significant opportunity for the wireless infrastructure industry, combining high power capabilities with advanced thermal performance to enable a smaller RF subsystem,” said Pierre Piel, NXP Vice President and General Manager for Radio Power.
“This innovation allows the deployment of more environmentally friendly base stations and the network density needed to realize the full performance benefits of 5G.”
NXP’s top-side cooled devices eliminate the specific RF shield, employ a cheaper and simpler printed circuit board, and separate thermal management from RF design. These capabilities allow networking solution suppliers to construct thinner, lighter 5G radios for mobile network operators in less time.
32T32R, 200 W radios covering 3.3 GHz to 3.8 GHz use the first top-side cooled RF power module series. The devices achieve 31 dB gain and 46% efficiency across 400 MHz of instantaneous bandwidth using the company’s LDMOS and GaN semiconductor technology.
A5M34TG140-TC, A5M35TG140-TC, and A5M36TG140-TC are available now. NXP RapidRF reference boards will support the A5M36TG140-TC.